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Yield enhancement, driven by defect inspection, metrology and process control, offers chip makers, and manufacturers of other specialized silicon devices where thin film uniformity and contamination issues are also yield-critical, the best opportunity to control costs and improve efficiency. Existing optical inspection and metrology tools do not support rapid, sensitive, full wafer surface chemistry mapping, as they are not designed to provide information on non-visible monolayer contamination or charging defects. Qcept’s ChemetriQ® technology inspects for non-visual defect (NVD) contamination offering a real-time insight into process parameter effects on chemistry uniformity during production. Qcept's patented ChemetriQ wafer inspection platforms enable customers to improve yield and profitability with production speed technology that provides non-destructive full wafer, sub-monolayer sensitivity, and high-resolution mapping of wafer surface contamination and film non-uniformity. It has a variety of applications in semiconductor and MEMS production to improve yield. Driven by the patented Qcept Scanning Surface Potential Difference Imaging Sensor, the
system supports high-speed, ultra-sensitive inspection of 200mm and 300mm
wafers. Developed from more than 10 years of government-backed research at
the Georgia Institute of Technology, the Qcept Scanning SPDI sensor is a very high
data rate, non-contact instrument capable of detecting extremely small chemical
variations of surfaces under inspection, based on the principle of electronic
work function of materials.
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