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Technical Papers

March 2010

SEMATECH Surface Preparation and Cleaning Conference

"Charge-Induced Attraction of Particles in Surface Preparation and Clean Processes"

by Y. Yamada, H. Eda, M. Kodera, M. Tamaoki, A. Shimazaki of Toshiba Corporation; W. Usry, R. Newcomb of Qcept Technologies

October 2009

EuroAsia Semiconductor

Issue VI 2009

"New Eyes for Advanced Processes," Issue VI 2009: 19-22

by R. Spicer of Qcept Technologies

August 2009

Solid-State Technology

"Non-visual Defect Inspection for Comprehensive Yield Management "

by R. Spicer of Qcept Technologies

August 2009

Semiconductor International

"Defect Detection Drives to Greater Depths"

by Ruth DeJule, Contributing Editor -- Semiconductor International

June 2009

ASMC 2009

"A New Surface Analysis Method for Semiconductor Manufacturing based on Surface-Potential

Measurements "

by R. Schuetten, M. Kleber, M. Jerenz, I. Gregorius, B. Zimmermann, R. Kaesmaier, of Qimonda Dresden GmbH & Co OHG; R. Newcomb, J. Hickson, N. Tamayo of Qcept Technologies

June 2009

ASMC 2009

"Novel In-line Inspection Method for Non-visual Defects and Charging "

by K. Hoppner, R. Manuwald, T. Fahr, E. Zschech of Advanced Micro Devices; J. Hickson, N. Tamayo, R. Newcomb of Qcept Technologies

May 2009

Frontiers of Characterization and Metrology for Nanoelectronics - Albany, NY

"VOC & Metallic Contaminant Control For
SOI Process Monitoring"

by R. Brun, C. Moulin, C. Girard of Soitec and
B. Usry, R. Newcomb of Qcept Technologies

March 2009

SPCC 2009 - Austin, TX

"Optimization of Edge Clean Using Non-visual Defect Inspection "

by L. Gabette and A. Danel of CEA-LETI, Minatec, P. Besson of ST Microelectronics, R. Spicer, B. Usry, D. Peters, R. Newcomb of Qcept Technologies

March 2009

Semiconductor International

"Controlling Process-Induced Charging Heightens Productivity"

by R. Spicer, J. Hawthorne, D. Peters, R. Newcomb of Qcept Technologies

April 2008
SPCC 2008- Austin, TX
"Elimination of ESD Defects Using DICO2"
Contributors- J. Halladay, J. Yoo, K. Lam, J. Lansford and B. Brennan of Spansion Fab 25, B.Teeter of SEZ America, R. Newcomb and B. Usry of Qcept Technologies

April 2008

SPCC 2008- Austin, TX
"Imaging of Contamination on Wafers Using a Scanning Surface Potential Difference Measurement Technique"
Contributors- A. Danel, J.P. Barnes, S. Sage of CEA-LETI, R. Bryant, R. Newcomb and R. Spicer of Qcept Technologies

April 2008
SPCC 2008- Austin, TX
"Optimization of a Post Via Etch Wet Clean Process Using a Novel, Full-Wafer Inspection Technique for Non-Visual Defects"
Contributors - D. Scranton and J. Bryer of Semitool,     R. Newcomb and B. Usry of Qcept Technologies

April 2008
Solid State Technology

"Full-Wafer Post-Via Wet Clean Non-Visual Defect Inspection"

Contributors - D. Scranton, J. Bryer, Semitool, Inc., Kalispell, MT and R. Newcomb, B. Usry, Qcept Technologies

October 2007

Advanced Substrate News
"Non-Optical Inspection Technology Detects the Unseen" by R. Newcomb, VP, Business Development and Applications, Qcept Technologies

September 2006

UCPSS 2006
"Novel Full Wafer Inspection Technology for Non-Visual Residue Defects"

Contributors- R. Bryant, J. Hawthorne, J. Hickson of Qcept Technologies

February 2005

MICRO Magazine
"Inspecting Wafers Using a Potential Difference Imaging Sensor Method"

Contributors- D. Maloney and K. Ip of DuPont EKC Technology, D. Sowell of Intellimetrics, Inc. and C. Yang, J. Hawthorne, B. Steele, R. Bryant of Qcept Technologies




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