April 2008
SPCC 2008- Austin, TX
"Elimination of ESD Defects Using DICO2"
Contributors- John Halladay, Joohwan Yoo, Kinsang Lam, Jeremy Lansford and Bill Brennan of Spansion Fab 25, Barbara Teeter of SEZ America, Robert Newcomb and Bill Usry of Qcept Technologies.

SPCC 2008- Austin, TX
"Imaging of Contamination on Wafers Using a Scanning Surface Potential Difference Measurement Technique"
Contributors- A. Danel, J.P. Barnes, S. Sage of CEA-LETI, MINATEC, R. Bryant,

R. Newcomb and R. Spicer of Qcept Technologies

April 2008
SPCC 2008- Austin, TX
"Optimization of a Post Via Etch Wet Clean Process Using a Novel, Full-Wafer Inspection Technique for Non-Visual Defects"
Contributors - Dana Scranton and Jim Byer of Semitool, Robert Newcomb and Bill Usry of Qcept Technologies Inc.

October 2007

Advanced Substrate News
"Non-Optical Inspection Technology Detects the Unseen" by Robert Newcomb, VP, Business Development and Applications,

September 2006

UCPSS 2006
"Novel Full Wafer Inspection Technology for Non-Visual Residue Defects"

February 2005

MICRO Magazine
"Inspecting Wafers Using a Potential Difference Imaging Sensor Method"